• Contract built module package minus the electronics
• Provides passive alignment to the active components
• Compatible with MT, SC, LC and MT-RJ connections
• Built for MM or SM module applications
• Available in custom materials and colors
• Made with custom features to meet your specific packaging needs
• Part dimensional control to < 3um
• Made for solder reflow applications

Specifications

• Meets TIA standards EIA/TIA 604-5 Type MPO and IEC Standard 61754-7

Applications

• This technology provides a complete model package for a variety of VCSEL/detector designs

For quotation and availability of your specific Packaging needs, contact Customer Service at: phone 828-323-8883 • fax: 828-326-8808